Dicing Blade×日本技術産業 - List of Manufacturers, Suppliers, Companies and Products

Dicing Blade Product List

1～3 item / All 3 items

Displayed results

Dicing Blade "Metal Sintered Dicing Blade"

Highly adaptable to soft and hard materials! A long-lasting dicing blade based on metal.

The "Metal Sintered Dicing Blade" is a dicing blade composed of abrasives embedded in a metal substrate. Through a unique closed mold sintering process, the particle size of the diamond, the density of the diamond, and the metal binder are optimized to meet specific application precision and blade lifespan according to needs. The metal binder provides an extremely stable, stress-free substrate, and can be customized to meet the hardness and load resistance required for various dicing applications. 【Features】 ■ Various substrates for a wide range of applications ■ Low wear and long blade lifespan ■ High precision in blade dimensions ■ High precision in dicing ■ Attractive ownership cost *For more details, please refer to the PDF materials or feel free to contact us.

Company：日本技術産業
Price：Other

Other processing machines
Wafer processing/polishing equipment
Plastic processing machines (cutting and rolling)

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Dicing Blade "Nickel Bond Blade"

A soft material and a hard material that undergoes machining! A long-lasting blade with excellent wear resistance.

The "Nickel Bond Blade" is a dicing blade composed of an abrasive embedded in a nickel bond substrate. It is manufactured using an artistically controlled electronic forming process, ensuring that diamonds are uniformly distributed throughout the nickel layer. This process not only allows the blade to be manufactured with extremely tight tolerances but also enables customization to meet specific customer requirements regarding particle size, hardness, and distribution. 【Features】 ■ Excellent wear resistance with a hard binder ■ Extremely thin blades (down to .0008”) ■ Outstanding durability against high exposure ■ Highly precise dicing ■ Exceptional blade longevity *For more details, please refer to the PDF document or feel free to contact us.

Company：日本技術産業
Price：Other

Other processing machines
Wafer processing/polishing equipment
Plastic processing machines (cutting and rolling)

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Dicing Blade "Resin Bond Blade"

Constantly exposing diamonds through self-grinding! Excellent cutting ability to handle hard and brittle materials.

The "Resin Bond Blade" is a dicing blade composed of abrasives embedded in a resin bond base. The blade's edge continuously exposes new diamonds, and the speed is controlled to keep the edge sharp, achieving highly accurate cuts with remarkable yield and long blade life. It is suitable for hard and brittle materials such as alumina, glass, and quartz. 【Features】 ■ Self-sharpening base that exposes diamonds ■ Excellent cutting performance ■ Base suitable for hard, durable, and complex materials ■ Highly precise dicing ■ Attractive ownership cost *For more details, please refer to the PDF document or feel free to contact us.